SN74CBT3244

SCDS001O – NOVEMBER 1992 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.5

7

V

(2)

–0.5

7

V

Continuous channel current

128

mA

–50

mA

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

±1500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

4.5

5.5

V

High-level control input voltage

2

V

Low-level control input voltage

0.8

V

Operating free-air temperature

–40

85

°C

(1)

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information Package

SN74CBT3244

DB

DBQ

DGV

PW

RGY

UNIT

(SSOP)

(SSOP)

(TVSOP)

(TSSOP)

(VQFN)

20 PINS

20 PINS

20 PINS

20 PINS

20 PINS

Junction-to-ambient thermal resistance

70

68

92

83

37

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

4

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