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SN74CBT3244 Datasheet(PDF) 4 Page - Texas Instruments |
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SN74CBT3244 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page SN74CBT3244 SCDS001O – NOVEMBER 1992 – REVISED SEPTEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VCC –0.5 7 V Input voltage, VI (2) –0.5 7 V Continuous channel current 128 mA Clamp current, IK (VI/O < 0) –50 mA Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VIH High-level control input voltage 2 V VIL Low-level control input voltage 0.8 V TA Operating free-air temperature –40 85 °C (1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. 6.4 Thermal Information Package SN74CBT3244 DB DBQ DGV PW RGY THERMAL METRIC(1)(2) UNIT (SSOP) (SSOP) (TVSOP) (TSSOP) (VQFN) 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 70 68 92 83 37 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance with JESD 51-7. 4 Submit Documentation Feedback Copyright © 1992–2015, Texas Instruments Incorporated Product Folder Links: SN74CBT3244 |
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