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SN74CBT3251PWLE Datasheet(PDF) 4 Page - Texas Instruments |
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SN74CBT3251PWLE Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page SN74CBT3251 SCDS019M – MAY 1995 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VCC –0.5 7 V Input voltage, VI (2) –0.5 7 V Continuous channel current 128 mA Input clamp current, IK (VI/O < 0) –50 mA Maximum junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 4 5.5 V VIH High-level control input voltage 2 V VIL Low-level control input voltage 0.8 V TA Operating free-air temperature –40 85 °C 6.4 Thermal Information SN74CBT3251 D DB DBQ PW RGY THERMAL METRIC(1) UNIT (SOIC) (SSOP) (SSOP) (TSSOP) (VQFN) 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 73(2) 82(2) 90(2) 108(2) 39(3) °C/W RθJC(top) Junction-to-case (top) thermal resistance 70.6 49.0 59.0 41.6 52.8 °C/W RθJB Junction-to-board thermal resistance 77.8 49.4 50.1 51.9 20.4 °C/W ψJT Junction-to-top characterization parameter 24.3 10.5 13.9 4.0 1.1 °C/W ψJB Junction-to-board characterization parameter 77.4 48.8 49.7 51.3 20.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — 6.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance with JESD 51-7. (3) The package thermal impedance is calculated in accordance with JESD 51-5. 4 Submit Documentation Feedback Copyright © 1995–2015, Texas Instruments Incorporated Product Folder Links: SN74CBT3251 |
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