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RFCM5304PCK-410 Datasheet(PDF) 4 Page - RF Micro Devices |
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RFCM5304PCK-410 Datasheet(HTML) 4 Page - RF Micro Devices |
4 / 7 page RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 DS150319 For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com. The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 4 of 7 RFCM5304 Evaluation Board Assembly Drawing Note: The ground plane of the RFCM5304 module should be soldered onto a board equipped with as many thermal vias as possible. Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC power. In any case the module backside temperature should not exceed 100°C. |
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Similar Description - RFCM5304PCK-410 |
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