RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS150319

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

4 of 7

RFCM5304

Evaluation Board Assembly Drawing

Note:

The ground plane of the RFCM5304 module should be soldered onto a board equipped with as many thermal vias as possible.

Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC

power. In any case the module backside temperature should not exceed 100°C.