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DF13C-8S-1.25DSA Datasheet(PDF) 11 Page - Hirose Electric |
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DF13C-8S-1.25DSA Datasheet(HTML) 11 Page - Hirose Electric |
11 / 11 page B193 BPrecautions 1. Recommended Temperature Profile (SMT) Note 1.This process is allowed up to twice under the same condition. However, the interval between the first and second processes must be maintained at the room temperature. Note 2.The temperature indicates the board surface temperature in the connector lead area. 2. Recommended Soldering Condition (SMT) Manual soldering: 290ç for 2 seconds 3. Recommended Screen Thickness (SMT) 0.15 to 0.2mm 4. Board Warpage (SMT) Max 0.03mm in the connector center area, based on both connector edges 5. Recommended Soldering Flow: 250ç for 3 seconds 5. Condition (Through hole) Manual soldering: 290ç for 2 seconds 6. Cleaning Condition Refer to Nylon Connector Use Hand book. 7. Connection Condition Refer to Nylon Connector Use Hand book. sCarefully carry out the crimping operation according to "Crimping Condition Sheet" and "Crimping Quality Standard", because the crimping contact is an extremely small style. 8. Cautions sBe careful for the excessive scoop insertion/extraction, which will cause damage to the product. |
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