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B57330V2103260 Datasheet(PDF) 10 Page - TDK Electronics |
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B57330V2103260 Datasheet(HTML) 10 Page - TDK Electronics |
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10 / 22 page  1.4 Packing units for discrete chip and array chip Case size Chip thickness Cardboard tape Blister tape ∅ 180-mm reel ∅ 330-mm reel inch/mm th W W pcs. pcs. 0402/1005 0.5 mm 8 mm 10000 50000 0603/1608 0.8 mm 8 mm 8 mm 4000 16000 0805/2012 0.8 mm 8 mm 4000 16000 1.2 mm 8 mm 3000 12000 1206/3216 0.8 mm 8 mm 3000 12000 1.2 mm 8 mm 3000 12000 2 Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Temperature measurement and compensation B573**V2 SMD NTC thermistors, case size 0603 (1608) Standard series Page 10 of 22 Please read Cautions and warnings and Important notes at the end of this document. |
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