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AN-1035 Datasheet(PDF) 5 Page - International Rectifier |
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AN-1035 Datasheet(HTML) 5 Page - International Rectifier |
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5 / 42 page  DirectFET ® Technology AN-1035 Board Mounting Application Note www.irf.com Version 28 (revision history), April 2016 Page 5 of 42 Packaging DirectFET devices are supplied in tape and reel format (Figure 9). The gate contact is furthest from the tape index holes. loaded tape feed direction A B C D E F G H Dimensions (mm) Small can Medium can Large can Code Min Max Min Max Min Max A 7.90 8.10 7.90 8.10 11.90 12.10 B 3.90 4.10 3.90 4.10 3.90 4.10 C 11.90 12.30 11.90 12.30 15.90 16.30 D 5.45 5.55 5.45 5.55 7.40 7.60 E 4.00 4.20 5.10 5.30 7.20 7.40 F 5.00 5.20 6.50 6.70 9.90 10.10 G 1.50 NC 1.50 NC 1.50 NC H 1.50 1.60 1.50 1.60 1.50 1.60 Figure 9 Tape and reel packaging Storage requirements DirectFET devices are packed in sealed, nitrogen- purged, antistatic bags. Devices in unopened bags have a shelf life of two years. Devices may have a Moisture Sensitivity Level (MSL) of 1 or 3: this is shown on the bag label. Treating all devices in opened bags as MSL 3 will help to ensure good solderability but the devices must not be baked, even if they are not mounted within 168 hours of opening a bag. The reason for storing opened bags carefully is that the plating on some areas of the devices is photosensitive and can be tarnished by the high levels of atmospheric pollution that occur in some heavily industrialized areas. To reduce the risk of tarnishing, International Rectifier recommends that, when not in use, reels of devices should be resealed into the bags in which they are supplied. The bags provide protection against the ambient atmosphere. They also provide adequate protection against normal light levels but it is prudent to avoid prolonged exposure to bright light sources. Solder pastes International Rectifier evaluated different types of solder paste from various manufacturers. The properties of pastes vary from manufacturer to manufacturer, meaning that some perform better than others. In general, high slumping pastes tend to suffer more from solder balling than slump-resistant pastes; solder balling is discussed in the next section on stencil design. In addition, some pastes appear to be more prone to voiding than others. Solder alloys, metal contents and flux constituents all influence the rheology of the solder paste. This in turn influences how the paste reacts during processing. DirectFET products with a PbF suffix have been evaluated using both lead-containing pastes (Sn63 Pb37) and lead-free pastes (Sn96.5 Ag3.0 Cu0.5). Products without the PbF suffix are not recommended for use with lead-free pastes. Solder paste selection must take flux residues into consideration. Many customers use solder pastes that contain no-clean fluxes designed to be fully cured or ‘caramelized’ during the reflow process, forming an inert varnish-like residue that need not be washed off or removed. However, some solder pastes (marketed as ‘probeable’ or ‘pin-testable’) contain fluxes that remain soft or tacky for up to a month to enable underlying PCB pads to be electrically probed on an automated test system using pins or needle-type probes. Unfortunately, as the residues remain acidic and chemically active until they harden, they can cause electrical leakage and/or corrosion, especially in damp or moist environments. Therefore, International Rectifier recommends that assemblies using probeable or pin- testable solder pastes are not exposed to their intended operating environment or subjected to reliability testing that involves moisture testing for at least a month. Alternatively, such assemblies can be baked after electrical testing to cure the flux more quickly. Evaluations of both standard and lead-free devices used reflow profiles that conform to IPC/JEDEC standard J-STD-020C (July 2004 revision.) All devices were reflowed three times to simulate the building of a double- sided PCB and provide for one rework process. However, International Rectifier advises customers to refer to the technical datasheet for their selected solder paste for initial guidance when setting up reflow profiles, before they carry out optimization exercises. |
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