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S6E1C32C0AGN20000 Datasheet(PDF) 4 Page - Cypress Semiconductor

Part # S6E1C32C0AGN20000
Description  32-bit ARM짰 Cortex짰-M0 FM0 Microcontroller
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

S6E1C32C0AGN20000 Datasheet(HTML) 4 Page - Cypress Semiconductor

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Document Number: 002-00233 Rev.*B
Page 4 of 107
S6E1C3 Series
Table of Contents
Features................................................................................................................................................................................... 1
1. Product Lineup.................................................................................................................................................................. 6
2. Packages ........................................................................................................................................................................... 7
3. Pin Assignment................................................................................................................................................................. 8
4. List of Pin Functions....................................................................................................................................................... 15
5. I/O Circuit Type................................................................................................................................................................ 28
6. Handling Precautions ..................................................................................................................................................... 33
6.1
Precautions for Product Design................................................................................................................................... 33
6.2
Precautions for Package Mounting.............................................................................................................................. 34
6.3
Precautions for Use Environment................................................................................................................................ 36
7. Handling Devices ............................................................................................................................................................ 37
8. Block Diagram................................................................................................................................................................. 40
9. Memory Map .................................................................................................................................................................... 41
10. Pin Status in Each CPU State ........................................................................................................................................ 44
11. Electrical Characteristics ............................................................................................................................................... 47
11.1 Absolute Maximum Ratings......................................................................................................................................... 47
11.2 Recommended Operating Conditions.......................................................................................................................... 48
11.3 DC Characteristics....................................................................................................................................................... 49
11.3.1 Current Rating.............................................................................................................................................................. 49
11.3.2 Pin Characteristics ....................................................................................................................................................... 54
11.4 AC Characteristics....................................................................................................................................................... 55
11.4.1 Main Clock Input Characteristics.................................................................................................................................. 55
11.4.2 Sub Clock Input Characteristics ................................................................................................................................... 56
11.4.3 Built-in CR Oscillation Characteristics.......................................................................................................................... 57
11.4.4 Operating Conditions of Main PLL (In the Case of Using the Main Clock as the Input Clock of the PLL) .................... 58
11.4.5 Operating Conditions of Main PLL (In the Case of Using the Built-in High-Speed CR Clock as the Input Clock
of the Main PLL)........................................................................................................................................................... 58
11.4.6 Reset Input Characteristics .......................................................................................................................................... 59
11.4.7 Power-on Reset Timing................................................................................................................................................ 59
11.4.8 Base Timer Input Timing .............................................................................................................................................. 60
11.4.9 CSIO/SPI/UART Timing ............................................................................................................................................... 61
11.4.10 External Input Timing................................................................................................................................................ 78
11.4.11 I2C Timing / I2C Slave Timing................................................................................................................................... 79
11.4.12 I2S Timing (MFS-I2S Timing).................................................................................................................................... 80
11.4.13 Smart Card Interface Characteristics........................................................................................................................ 82
11.4.14 SW-DP Timing.......................................................................................................................................................... 83
11.5 12-bit A/D Converter.................................................................................................................................................... 84
11.6 USB Characteristics .................................................................................................................................................... 87
11.7 Low-Voltage Detection Characteristics........................................................................................................................ 92
11.7.1 Low-Voltage Detection Reset....................................................................................................................................... 92
11.7.2 Low-Voltage Detection Interrupt................................................................................................................................... 93
11.8 Flash Memory Write/Erase Characteristics ................................................................................................................. 94
11.9 Return Time from Low-Power Consumption Mode...................................................................................................... 95
11.9.1 Return Factor: Interrupt/WKUP .................................................................................................................................... 95
11.9.2 Return Factor: Reset.................................................................................................................................................... 97
12. Ordering Information ...................................................................................................................................................... 99
13. Package Dimensions .................................................................................................................................................... 100
Document History............................................................................................................................................................... 106


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