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B57869S0502+140 Datasheet(PDF) 10 Page - TDK Electronics |
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B57869S0502+140 Datasheet(HTML) 10 Page - TDK Electronics |
10 / 18 page Solder joint profiles for silver/nickel/tin terminations 1.3.3 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.3.4 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes. Temperature measurement B57869S Miniature sensors with bendable wires S869 Page 10 of 18 Please read Cautions and warnings and Important notes at the end of this document. |
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