NCV7462DQ0R2G datasheet(6/56 Pages) ONSEMI

Part #	NCV7462DQ0R2G

Description	LIN/CAN SBC/System-IC

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Manufacturer	ONSEMI [ON Semiconductor]

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NCV7462

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Table 2. ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Min

Max

Unit

Vmax_VS

Power supply voltage

−0.3

40

V

Vmax_WU1−3

Wake pins DC and transient voltage

−0.3

VS + 0.3

V

Vmax_OPOUT1/2

Opamp analog output voltage range

−0.3

VS + 0.3

V

Vmax_OUT1−4

Vmax_OUT_HS

High−side output voltage range

−0.3

VS + 0.3

V

Vmax_LS1/2

LS1/2 pin voltage range DC

LS1/2 pin transient voltage range (during flyback)

−0.3

40

65

V

Vmax_LIN

DC voltage on LIN pin

−20

40

V

Vmax_INH

DC voltage on INH pin

−0.3

VS + 0.3

V

Vmax_CANH/L

Vmax_VSPLIT

DC voltage on pin CANH, CANL and VSPLIT

−40

40

V

Vmax_VR1

Stabilized supply voltage, logic supply

−0.3

min (5.5,

VS + 0.3)

V

Vmax_VR2

Stabilized supply voltage

−0.3

28

V

Vmax_VCC_CAN

Supply input for the CAN transceiver

−0.3

5.5

V

Vmax_digIO

DC voltage at digital pins (RxDC, NRES, RxDL/INTN, SDI, SDO,

SCLK, CSN)

−0.3

VR1 + 0.3

V

Vmax_OP1/2(+/−)

Opamp input voltage range

−0.3

VS + 0.3

V

Vmax_TxDL(C)/FL

ASH

DC voltage at TxDL/FLASH and TxDC/FLASH inputs

−0.3

28

V

Wmax_LS1/2

Maximum clamping energy on LS1/2

36

mJ

Imax_LS1/2

Maximum LS1/2 pin current

500

mA

Maximum LS1/2 pin current, transient or without VS supply

−120

mA

Imax_input

Current injection into Vs related input pins

5

mA

ESD Human Body

Model

(100pF, 1500

W)

All pins

−2

+2

kV

Pins LIN, CANH/L, VSPLIT and WU1−3 to GND

−4

+4

Pins OUT_HS, OUT1−4, LS1/2 to GND

−4

+4

ESD following IEC

61000−4−2

(150 pF, 330

W)

Valid for pins VS, LIN, CANH/L, VSPLIT, WUx, OUT_HS, OUT1−4

− VS pin with reverse−protection and filtering capacitor

− VSPLIT pin stressed through split CAN termination

− WUx pins stressed through a serial resistor >10 k

W

− OUT_HS, OUT1−4 pins with parallel capacitor 10 nF

−6

+6

kV

ESD Charged

Device Model

following

JESD22−C101/AE

C−Q100−011

All pins

−500

+500

V

Corner pins

−750

+750

V

Tj_mr

Junction temperature

−40

+170

°C

Tstg

Storage Temperature Range

−55

+150

°C

MSL

Moisture Sensitivity Level (max. 260

°C processing)

MSL3

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

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