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C0402R225J4RACT050 Datasheet(PDF) 11 Page - Kemet Corporation

Part # C0402R225J4RACT050
Description  Surface Mount Multilayer Ceramic Chip Capacitors
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

C0402R225J4RACT050 Datasheet(HTML) 11 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note:
Package Size
(L" x W")
Force
Duration
0402
5 N (0.51 kg)
60 seconds
0603
10 N (1.02 kg)
≥ 0805
18 N (1.83 kg)
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability
J–STD–002
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling
KEMET defined
50 cycles (-55°C to +220°C). Measurement at 24 hours +/- 4 hours after test conclusion.
Biased Humidity
MIL–STD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Moisture Resistance
MIL–STD–202 Method 106 t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
1,000 hours at 175°C with 2 X rated voltage applied.
Storage Life
KEMET defined
200°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202 Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.


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