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CY62256
Document #: 38-05248 Rev. *C
Page 4 of 12
AC Test Loads and Waveforms
Data Retention Characteristics
Parameter
Description
Conditions[6]
Min.
Typ.[2]
Max.
Unit
VDR
VCC for Data Retention
2.0
V
ICCDR
Data Retention Current
L
VCC = 3.0V, CE > VCC − 0.3V,
VIN > VCC − 0.3V, or VIN < 0.3V
250
µA
LL
0.1
5
µA
LL - Ind’l
0.1
10
µA
LL - Auto
0.1
10
µA
tCDR[5]
Chip Deselect to Data Retention Time
0
ns
tR[5]
Operation Recovery Time
tRC
ns
Data Retention Waveform
Notes:
6.
No input may exceed VCC + 0.5V.
3.0V
5V
OUTPUT
R1 1800
Ω
R2
990
Ω
100 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
<5 ns
<5 ns
5V
OUTPUT
R1 1800 Ω
R2
990
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
1.77V
Equivalent to:
THÉVENIN EQUIVALENT
ALL INPUT PULSES
639
Ω
3.0V
3.0V
tCDR
VDR > 2V
DATA RETENTION MODE
tR
CE
VCC
Thermal Resistance
Description
Test Conditions
Symbol
DIP
SOIC
TSOP
RTSOP
Unit
Thermal Resistance
(Junction to Ambient)[5]
Still Air, soldered on a 4.25 x 1.125
inch, 4-layer printed circuit board
ΘJA
75.61
76.56
93.89
93.89
°C/W
Thermal Resistance
(Junction to Case)[5]
ΘJC
43.12
36.07
24.64
24.64
°C/W