Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

1. Flux and Solder

2. Note for Assembling

< Points of Attention about NFM Pattern Forms>

The loaded stresses are different to a chip depend on PCB materials and structures.

When the chip will be mounted on the metal PCB contained alumina material, PCB heat expansion/contraction

will be a cause of chip cracks because the coefficients of thermal expressions are different between metal PCB

and the chip itself. In case of mounting 1005 or smaller size of NFM on single-layered glass epoxy board,

chip cracks will be occurred because of the same reason.

< Thermal Shock >

Pre-heating should be in such a way that the temperature difference between solder and products surface is limited

to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is

limited to 100°C max.

3. Attention Regarding P.C.B. Bending

The following shall be considered when designing P.C.B.'s and laying out products.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

[Products direction]

Products shall be located in the sideways

direction (Length:a<b) to the mechanical stress.

(2) Products location on P.C.B. near seam for separation.

Products (A,B,C,D) shall be located carefully so that products are

not subject to the mechanical stress due to warping the board.

Because they may be subjected the mechanical stress in order

of A>C>B≒D.

4. Pre-heating Temperature

Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be

limited to 100°C max. to avoid the heat stress for the products.

5. Reflow Soldering

　　　　　　　　　　　　　　　

• Standard printing pattern of solder paste.

1) Soldering paste printing for reflow

• Standard thickness of solder paste: 100µm to 150µm.

• Use the solder paste printing pattern of the right pattern.

• For the resist and copper foil pattern, use standard land dimensions.

(in mm)

2) Soldering Conditions

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of

product quality.

Notice

Seam

Slit

A

D

B

C

b

a

Limit Profile

Standard Profile

90s±30s

230°C

260°C

245°C±3°C

220°C

30s

60s max.

180

150

Temp.

Time.(s)

(°C)

1.3

0.25

0.7

1.3

0.25

0.7

Flux

Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).

Do not use water-soluble flux.

Other flux (except above) Please contact us for details, then use.

Solder

Use Sn-3.0Ag-0.5Cu solder

Use of Sn-Zn based solder will deteriorate performance of products.

In case of using Sn-Zn based solder, please contact Murata in advance.

b

a

Standard Profile

Limit Profile

Pre-heating

150°C ~ 180°C , 90s ± 30s

Heating

above 220°C , 30s ~ 60s

above 230°C , 60s max.

Peak temperature

245°C ± 3°C

260°C , 10s

Cycle of reflow

2 times

2 times

JEMCPC-02243B

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