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NFM15PC473C1A3 Datasheet(PDF) 7 Page - Murata Manufacturing Co., Ltd. |
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NFM15PC473C1A3 Datasheet(HTML) 7 Page - Murata Manufacturing Co., Ltd. |
7 / 10 page Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 1. Flux and Solder 2. Note for Assembling < Points of Attention about NFM Pattern Forms> The loaded stresses are different to a chip depend on PCB materials and structures. When the chip will be mounted on the metal PCB contained alumina material, PCB heat expansion/contraction will be a cause of chip cracks because the coefficients of thermal expressions are different between metal PCB and the chip itself. In case of mounting 1005 or smaller size of NFM on single-layered glass epoxy board, chip cracks will be occurred because of the same reason. < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. [Products direction] Products shall be located in the sideways direction (Length:a<b) to the mechanical stress. (2) Products location on P.C.B. near seam for separation. Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A>C>B≒D. 4. Pre-heating Temperature Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100°C max. to avoid the heat stress for the products. 5. Reflow Soldering • Standard printing pattern of solder paste. 1) Soldering paste printing for reflow • Standard thickness of solder paste: 100µm to 150µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. (in mm) 2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Notice Seam Slit A D B C b a Length:a b Limit Profile Standard Profile 90s±30s 230°C 260°C 245°C±3°C 220°C 30s ~60s 60s max. 180 150 Temp. Time.(s) (°C) 1.3 0.25 0.7 1.3 0.25 0.7 Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Other flux (except above) Please contact us for details, then use. Solder Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. 〈Poor example〉 〈Good example〉 b a Standard Profile Limit Profile Pre-heating 150°C ~ 180°C , 90s ± 30s Heating above 220°C , 30s ~ 60s above 230°C , 60s max. Peak temperature 245°C ± 3°C 260°C , 10s Cycle of reflow 2 times 2 times JEMCPC-02243B 7 |
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