6. Reworking with Soldering iron

The following conditions shall be strictly followed when using a soldering iron.

• Tip temperature : 340°C max.

• Tip diameter : φ2mm max.

• Soldering time : 3(+1,-0) s

• Times : 1time only.

• Soldering iron output : 30W max.

Note : Adjust the pre-heat temperature to ⊿T＜190℃ between the component and a soldering iron.

Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the material due to the thermal shock.

7. Solder Volume

Solder shall be used not to be exceeded as shown below.

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Excessive solder volume may cause the failure of mechanical or electrical performance.

8. Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))

(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the

mounted products and P.C.B.

Power

: 20W / l max.

Frequency : 28kHz to 40kHz

Time

: 5 minutes max.

(3) Cleaner

1. Cleaner

　　Isopropyl alcohol (IPA)

2. Aqueous agent

　　PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to

remove the cleaner.

(5) Other cleaning

Please contact us.

9. Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the performance, such as

insulation resistance may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

10. Resin coating

The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin

to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please

make the reliability evaluation with the product mounted in your application set.

11. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

　　　　　　Bending

　　　　　　　　　　　　　　　　

　　　　　Twisting

Notice

Upper Limit

Recommendable

1/3T

t

Recommendable

Upper Limit

1/3T≤t (T:Chip Thickness)

Upper Limit

Recommendable

1/3T

t

Recommendable

Upper Limit

Upper Limit

Recommendable

1/3T

t

Recommendable

Upper Limit

JEMCPC-02243B

8