12. Component Mounting

If low bottom dead point of the pick-up nozzle is too low, chip cracks will be occurred because an extra power will be

added to the chip during mounting. Therefore, the bottom dead point of pick-up nozzle must be set on/over the upper

surface of the PCB. Adjusting is required when the bottom dead point will be set by correcting board warp.

It is recommended that using the larger pick-up nozzle than chip length for avoiding what force impact will be centered

to the middle point of components. Before assembling, please confirm its mounting accuracy under the best condition.

13. Standard Land Dimensions

The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.

Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be

arranged according to the figure to reinforce the ground-pattern.

In case of changing the land dimentions marked by ※, a solder bridge between terminations of the chip

could occur. In this case, please contact us before change.

< Standard land dimensions for reflow >

･Side on which chips are mounted

(in mm)

14. Storage condition

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage environment condition

・Products should be stored in the warehouse on the following conditions.

Temperature: -10 to +40°C

Humidity: 15 to 85% relative humidity

No rapid change on temperature and humidity

・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode,

resulting in poor solderability.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

・Products should be stored under the airtight packaged condition.

(3) Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

Notice

吸着ノズル投影線

吸着ノズル長手寸法

longer direction of

pick-up nozzle

shape of pick-up nozzle

吸着ノズル投影線

吸着ノズル長手寸法

longer direction of

pick-up nozzle

shape of pick-up nozzle

吸着ノズル

チップ搭載時の

吸着ノズル位置

吸着ノズルの設定下死点

○

×

pick-up nozzle

pick-up nozzle position

in component placing

position adjusting of

bottom dead point

吸着ノズル

チップ搭載時の

吸着ノズル位置

吸着ノズルの設定下死点

○

×

pick-up nozzle

pick-up nozzle position

in component placing

position adjusting of

bottom dead point

good

poor

①

②

③

JEMCPC-02243B

9