6. Flow Soldering

1)Printing of Adhesive

Adhesive amount shall be about 0.06mg per chip to obtain enough adhesive strength.

The adhesive position is as follows.

2)Soldering Conditions

Standard soldering profile and the limit soldering profile is as follows.

7. Reworking with Soldering iron

The following conditions shall be strictly followed when using a soldering iron.

・Pre-heating : 150°C, 1 minute

・Soldering iron output : 30W max.

・Tip temperature : 350°C max.

・

Tip diameter : φ3mm max.

・Soldering time : 3(+1,-0) s

・Times : 2times max.

Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material

due to the thermal shock.

8. Solder Volume

Solder shall be used not to be exceeded as shown below.

　Accordingly increasing the solder volume, the mechanical stress to product is also increased.

　Excessive solder volume may cause the failure of mechanical or electrical performance.

9. Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))

(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the

mounted products and P.C.B.

Power

: 20W / l max.

Frequency : 28kHz to 40kHz

Time

: 5 minutes max.

(3) Cleaner

1. Cleaner

　　Isopropyl alcohol (IPA)

2. Aqueous agent

　　PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to

remove the cleaner.

(5) Other cleaning

Please contact us.

10. Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the performance, such as

insulation resistance may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

Notice

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

Upper Limit

Recommendable

1/3T

t

Recommendable

Upper Limit

Adhesive

Position of adhesive

265°C±3°C

250°C

60s min.

150

Limit Profile

Time.(s)

Temp.

Heating Time

Standard Profile

Standard Profile

Limit Profile

Pre-heating

150°C, 60s min.

Heating

250°C, 4s ~ 6s

265°C ± 3°C, 5s max.

Cycle of reflow

2 times

2 times

JEMCPC-02253A

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