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Input Voltage

35V

Power Dissipation

600 mW

Storage Temperature Range

b

Operating Temperature Range

Soldering Information

TO-5 (H) Package (10 sec)

a

300 C

See AN-450 ‘‘Surface Mounting Methods and Their Effect

on Product Reliability’’ (Appendix D) for other methods of

soldering surface mount devices

LM368-25

Tested

Design

Units

Parameter

Conditions

Typical

Limit

Limit

(Max unless

(Note 2)

(Note 3)

noted)

g

002

g

02

%

Line Regulation

g

00001

g

00005

%V

Load Regulation (Note 8)

g

00003

g

00025

%mA

Thermal Regulation

g

0005

g

002

%100 mW

Quiescent Current

350

550

m

A

3

5

m

AV

Temperature Coefficient

g

11

g

20

ppm C

(Note 5)

LM368-25

g

15

g

30

ppm C

Short Circuit Current

30

70

100

mA

Noise

01 – 10 Hz

12

uVp-p

100 Hz – 10 kHz

420

nV

19 – 52

22 – 50

V min

Note 1

Note 2

Tested Limits are guaranteed and 100% tested in production

Note 3

Design Limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges These limits are not used to

calculate outgoing quality levels

Note 4

Thermal Regulation is defined as the change in the output Voltage at a time T after a step change in power dissipation of 100 mW

Note 5

Temperature Range (See graphs) There is no guarantee that the Specified Temperatures are exactly at the minimum or maximum deviation

Note 6

Note 7

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur DC and AC electrical specifications do not apply when operating

the device beyond its Rated Operating Conditions (see Note 1 and Conditions)

Note 8

Load regulation is measured on the output pin at a point

below the base of the package Regulation is measured at constant junction temperature

using pulse testing with a low duty cycle Changes in output voltage due to heating effects are covered under the specification for thermal regulation

2