MOTOROLA

MAC7100 Microcontroller Family Hardware Specifications

7

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

ElectricalCharacteristics

3.5.1

Power Dissipation Simulation Details

Comments:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board at the center lead. For fused lead packages, the adjacent lead is used.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC

JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Rating

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

RθJA

44

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

RθJMA

34

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

RθJMA

37

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

RθJMA

29

°C/W

1, 3

Junction to Board

RθJB

18

°C/W

4

Junction to Case

RθJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Rating

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

RθJA

42

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

RθJMA

34

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

RθJMA

35

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

RθJMA

30

°C/W

1, 3

Junction to Board

RθJB

22

°C/W

4

Junction to Case

RθJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Rating

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

RθJA

42

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

RθJMA

34

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

RθJMA

35

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

RθJMA

30

°C/W

1, 3

Junction to Board

RθJB

22

°C/W

4

Junction to Case

RθJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Rating

Value

Unit

Comments

Junction to Ambient (Natural Convection)

Single layer board (1s)

RθJA

46

°C/W

1, 2

Junction to Ambient (Natural Convection)

Four layer board (2s2p)

RθJMA

29

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Single layer board (1s)

RθJMA

38

°C/W

1, 3

Junction to Ambient (@ 200 ft./min.)

Four layer board (2s2p)

RθJMA

26

°C/W

1, 3

Junction to Board

RθJB

19

°C/W

4

Junction to Case

RθJC

7°C/W

5

Junction to Package Top

Natural Convection

ΨJT

2°C/W

6

Freescale Semiconductor, Inc.

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