DATA SHEET • SMP1325-085LF: SURFACE-MOUNT PIN DIODE

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201648F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 13, 2015

5

Package Dimensions

The PCB layout footprint for the SMP1325-085LF is shown in

Figure 6. Typical part markings are shown in Figure 7. Package

dimensions for the 3-pin QFN are provided in Figure 8, and

Figure 9 provides the tape and reel dimensions.

Package and Handling Information

Instructions on the shipping container label regarding exposure to

moisture after the container seal is broken must be followed.

Otherwise, problems related to moisture absorption may occur

when the part is subjected to high temperature during solder

assembly.

The SMP1325-085LF is rated to Moisture Sensitivity Level 1

(MSL1) at 260

C. It can be used for lead or lead-free soldering.

For additional information, refer to the Skyworks Application Note,

Solder Reflow Information, document number 200164.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.

Pin 1

Pin 2

Part Outline

2X 0.27

R0.20

Exposed Soldering

Area Typ.

Pin 3

2X 0.55

2X 0.60

2X 0.85

2X 0.25

S2923

Figure 6. SMP1325-085LF PCB Layout Footprint

Orientation

Indicator

31

31

Skyworks Part #

Figure 7. Typical Part Markings

(Top View)