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UM3302H Datasheet(PDF) 11 Page - Union Semiconductor, Inc. |
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UM3302H Datasheet(HTML) 11 Page - Union Semiconductor, Inc. |
11 / 13 page ________________________________________________________________________ http://www.union-ic.com Rev.08 Dec.2014 11/13 UM3302H/UM3302Q Package Information UM3302H: CSP8 1.90×0.90 Outline Drawing E Ball 1 Index Aera Top View Bottom View Side View C E1 DIMENSIONS Symbol MILLIMETERS INCHES Min Max Min Max A 0.65 0.026 A1 0.21 0.24 0.008 0.010 D 1.85 1.95 0.074 0.078 E 0.85 0.95 0.034 0.038 D1 1.50BSC 0.06BSC E1 0.50BSC 0.020BSC e 0.50BSC 0.02BSC b 0.27 0.32 0.011 0.013 C 0.25BSC 0.01BSC L 0.25BSC 0.01BSC Land Pattern NOTES: 1. Bump is Lead Free Sn/Ag/Cu. 2. Unit: mm; 3. Non-solder mask defined copper landing pad. 4. Laser Mark on silicon die back; back-lapped. Tape and Reel Orientation M |
Similar Part No. - UM3302H_14 |
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Similar Description - UM3302H_14 |
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