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UM6411 Datasheet(PDF) 5 Page - Union Semiconductor, Inc. |
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UM6411 Datasheet(HTML) 5 Page - Union Semiconductor, Inc. |
5 / 7 page ___________________________________________________________________________ http://www.union-ic.com Rev.04 Mar.2016 5/7 UM6411 Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . |
Similar Part No. - UM6411_16 |
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Similar Description - UM6411_16 |
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