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DMN10H700S-7 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMN10H700S-7 Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 7 page DMN10H700S Document number: DS38103 Rev. 2 - 2 2 of 7 www.diodes.com April 2016 © Diodes Incorporated DMN10H700S Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 100 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +70°C ID 0.70 0.56 A Pulsed Drain Current (10 μs Pulse, Duty Cycle ≦1%) IDM 2.5 A Maximum Body Diode Continuous Current (Note 6) IS 0.6 A Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Total Power Dissipation (Note 5) PD 0.4 W (Note 6) 0.5 Thermal Resistance, Junction to Ambient (Note 5) Steady state RθJA 303 °C/W Thermal Resistance, Junction to Ambient (Note 6) RθJA 239 Thermal Resistance, Junction to Case (Note 6) RθJC 88 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 100 V VGS = 0V, ID = 250µA Zero Gate Voltage Drain Current IDSS 1 µA VDS = 100V, VGS = 0V Gate-Source Leakage IGSS ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(TH) 2.0 2.7 4.0 V VDS = VGS, ID = 250µA Static Drain-Source On-Resistance RDS(ON) 540 700 m Ω VGS = 10V, ID = 1.5A 550 900 VGS = 6.0V, ID = 1.0A Diode Forward Voltage VSD 0.9 1.1 V VGS = 0V, IS = 1.5A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss 235 pF VDS = 50V, VGS = 0V, f = 1.0MHz Output Capacitance Coss 7 Reverse Transfer Capacitance Crss 5 Gate Resistance RG 1.9 Ω VDS = 0V, VGS = 0V, f = 1.0MHz Total Gate Charge Qg 4.6 nC VDS = 50V, VGS = 10V, ID = 1.0A Gate-Source Charge Qgs 1.1 Gate-Drain Charge Qgd 1.6 Turn-On Delay Time tD(ON) 2.5 ns VDS = 50V, ID = 1.0A, VGS = 10V, RG = 6.0 Ω Turn-On Rise Time tR 1.1 Turn-Off Delay Time tD(OFF) 5.4 Turn-Off Fall Time tF 1.0 Reverse Recovery Time tRR 22 ns VR = 100V, IF=1.8A, di/dt=100A/µs Reverse Recovery Charge QRR 15 nC Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout. 7 .Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to production testing. |
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