Product Dimensions

32

1

PIN 1

TOP VIEW

SIDE VIEW

BOTTOM VIEW

C

A1

SEATING PLANE

B

D

A

H

H

K

K

F

D

J

J

E

XXXXX

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DIMENSIONS:

MM

(INCHES)

Dim.

Min.

Typ.

Max.

A

0.80

(.031)

0.90

(.035)

1.00

(.039)

A1

0.00

(.000)

0.025

(.001)

0.050

(.002)

B

8.15

(.321)

8.25

(.325)

8.35

(.329)

C

3.90

(.154)

4.00

(.157)

4.10

(.161)

D

2.55

(.100)

2.60

(.102)

2.65

(.104)

E

1.10

(.043)

1.15

(.045)

1.20

(.047)

F

3.45

(.136)

3.50

(.138)

3.55

(.140)

H

0.20

(.008)

0.25

(.010)

0.30

(.012)

J

0.65

(.026)

0.70

(.028)

0.75

(.030)

K

0.20

(.008)

0.25

(.010)

0.30

(.012)

Recommended Pad Layout

3.55

(.140)

0.70

(.028)

1.15

(.045)

2.625

(.103)

Pad #

Apply

1

In/Out

2NC

3

In/Out

NC = Solder to PCB; do not make electrical

connection, do not connect to ground.

Pad Designation

ness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any

power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not allow

any signal, ground or power signals beneath any of the pads of the device.

Thermal Resistances

Symbol

Parameter

Value

Unit

Junction to leads (package)

116

°C/W

Reflow Profile

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.