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C850-260-WH Datasheet(PDF) 4 Page - Bourns Electronic Solutions |
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C850-260-WH Datasheet(HTML) 4 Page - Bourns Electronic Solutions |
4 / 6 page C650 and C850 Series TBU® High-Speed Protectors Product Dimensions 32 1 PIN 1 TOP VIEW SIDE VIEW BOTTOM VIEW C A1 SEATING PLANE B D A H H K K F D J J E XXXXX YWWLL DIMENSIONS: MM (INCHES) Dim. Min. Typ. Max. A 0.80 (.031) 0.90 (.035) 1.00 (.039) A1 0.00 (.000) 0.025 (.001) 0.050 (.002) B 8.15 (.321) 8.25 (.325) 8.35 (.329) C 3.90 (.154) 4.00 (.157) 4.10 (.161) D 2.55 (.100) 2.60 (.102) 2.65 (.104) E 1.10 (.043) 1.15 (.045) 1.20 (.047) F 3.45 (.136) 3.50 (.138) 3.55 (.140) H 0.20 (.008) 0.25 (.010) 0.30 (.012) J 0.65 (.026) 0.70 (.028) 0.75 (.030) K 0.20 (.008) 0.25 (.010) 0.30 (.012) Recommended Pad Layout 3.55 (.140) 0.70 (.028) 1.15 (.045) 2.625 (.103) Pad # Apply 1 In/Out 2NC 3 In/Out NC = Solder to PCB; do not make electrical connection, do not connect to ground. Pad Designation TBU® protectors have matte-tin termination finish. Suggested layout should use non-solder mask define (NSMD). Recommended stencil thick- ness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the pads of the device. Thermal Resistances Symbol Parameter Value Unit Rth(j-a) Junction to leads (package) 116 °C/W Reflow Profile Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max. Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) 150 °C 200 °C 60-180 sec. Time maintained above: - Temperature (TL) - Time (tL) 217 °C 60-150 sec. Peak/Classification Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec. Ramp-Down Rate 6 °C/sec. max. Time 25 °C to Peak Temperature 8 min. max. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. |
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