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MKP1847712384P4 Datasheet(PDF) 11 Page - Vishay Siliconix |
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MKP1847712384P4 Datasheet(HTML) 11 Page - Vishay Siliconix |
11 / 15 page MKP1847 AC Filtering www.vishay.com Vishay Roederstein Revision: 22-Sep-14 11 Document Number: 28172 For technical questions, contact: dc-film@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Power Dissipation and Maximum Component Temperature Rise The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of the free air ambient temperature. The component temperature rise ( T) can be measured or calculated by T = P/G: • T = component temperature rise (°C) with a maximum of 15 °C • P = power dissipation of the component (mW) • G = heat conductivity of the component (mW/°C) MEASURING THE COMPONENT TEMPERATURE The case temperature is measured in unloaded (Tamb) and maximum loaded condition (TC). The temperature rise is given by T = T C - Tamb. To avoid thermal radiation or convection, the capacitor must be tested in a closed area from air circulation. APPLICATION NOTE AND LIMITING CONDITIONS These capacitors are not suitable for mains applications as across-the-line capacitors without additional protection. These mains applications are strictly regulated in safety standards and therefore electromagnetic interference suppression capacitors conforming the standards must be used. To select the capacitor for a certain application, the following conditions must be checked: • The peak voltage (UP+) shall not be greater than 2 x URMS • The peak-to-peak ripple voltage (UPP) shall not be greater than 2 x 2 x URMS • The voltage pulse slope (dU/dt) shall not exceed the rated pulse slope at the DC voltage rating. If the pulse voltage is lower than the rated DC voltage, the rated voltage pulse slope may be multiplied by UNDC and divided by the applied voltage. For all other pulses following equation must be fulfilled: T is the pulse duration • The maximum component surface temperature must be lower than 105 °C and maximum temperature rise between case and free air ambient shall be lower than 15 °C. HEAT CONDUCTIVITY DIMENSIONS (mm) HEAT CONDUCTIVITY (mW/°C) w h l PITCH 27.5 mm PITCH 37.5 mm PITCH 52.5 mm 9.0 19.0 32.0 16 - - 11.0 21.0 32.0 19 - - 13.0 23.0 32.0 22 - - 15.0 25.0 32.0 25 - - 18.0 28.0 32.0 30 - - 21.0 31.0 32.0 35 - - 18.5 35.5 43.0 - 45 - 21.5 38.5 43.0 - 51 - 24.0 44.0 42.0 - 59 - 30.0 45.0 42.0 - 68 - 25.0 45.0 57.5 - - 77 30.0 45.0 57.5 - - 85 35.0 50.0 57.5 - - 100 45.0 45.0 57.5 - - 108 Thermocouple 2 x dU dt ------- 2 x dt U NDC x dU dt ------- rated 0 T |
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