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CY7C1041CV33
Document #: 38-05134 Rev. *D
Page 3 of 11
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65
°C to +150°C
Ambient Temperature with
Power Applied............................................. –55
°C to +125°C
Supply Voltage on VCC to Relative GND
[2] .... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State[2] ....................................–0.5V to VCC + 0.5V
DC Input Voltage[2] ................................ –0.5V to VCC + 0.5V
Current into Outputs (LOW) ........................................ 20 mA
Operating Range
Range
Ambient
Temperature
VCC
Commercial
0
°C to +70°C
3.3V
± 0.3V
Industrial
–40
°C to +85°C
DC Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
-8
-10
-12
-15
-20
Unit
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
VOH
Output HIGH Voltage VCC = Min.,
IOH = –4.0 mA
2.4
2.4
2.4
2.4
2.4
V
VOL
Output LOW Voltage
VCC = Min.,
IOL = 8.0 mA
0.4
0.4
0.4
0.4
0.4
V
VIH
Input HIGH Voltage
2.0 VCC
+ 0.3
2.0 VCC
+ 0.3
2.0 VCC
+ 0.3
2.0 VCC
+ 0.3
2.0 VCC
+ 0.3
V
VIL
[2]
Input LOW Voltage
–0.3 0.8 –0.3 0.8 –0.3 0.8 –0.3 0.8 –0.3 0.8
V
IIX
Input Load Current
GND < VI < VCC
–1
+1
–1+1
–1+1
–1+1
–1+1
µA
IOZ
Output Leakage
Current
GND < VOUT < VCC,
Output Disabled
–1
+1
–1+1
–1+1
–1+1
–1+1
µA
ICC
VCC Operating
Supply Current
VCC = Max., f = fMAX =
1/tRC
Comm’l
100
9085
8075
mA
Indus.
110
100
95
90
85
mA
ISB1
Automatic CE
Power-down Current
—TTL Inputs
Max. VCC, CE > VIH
VIN > VIH or
VIN < VIL, f = fMAX
40
40
40
40
40
mA
ISB2
Automatic CE
Power-down Current
—CMOS Inputs
Max. VCC,
CE > VCC – 0.3V,
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
Comm’l
Indus.
10
10
10
10
10
mA
Shaded areas contain advance information.
Capacitance[3]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 3.3V
8
pF
COUT
I/O Capacitance
8
pF
Notes:
2.
Minimum voltage is–2.0V for pulse durations of less than 20 ns.
3.
Tested initially and after any design or process changes that may affect these parameters.
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