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LDBAA2120GC5N0 Datasheet(PDF) 8 Page - Kemet Corporation |
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LDBAA2120GC5N0 Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 12 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 8 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Flux/Cleaning/Storage and Moisture cont'd Storage and moisture recommendations KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life (temperature≤40°C/relativehumidity≤90%).AftertheMBBhasbeenopened,componentsmaystayinareaswithcontrolled temperatureandhumidity(temperature≤30°C/relativehumidity≤60%)for168hours[MSL3](ratedvoltage≤100VDC)or696hours [MSL2a](ratedvoltage>100VDC).Forlongerperiodsoftimeand/orhighertemperatureand/orhigherrelativehumidityvalues,it is absolutely necessary to protect the components against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not respected,componentsrequireabaking(minimumtime:48hoursat55±5°C)beforethereflow. Manual assembly recommendations If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the components. Our recommendations are the following (see Fig. 1): 1. When using tweezers, the components should be gripped across the two terminations (A); 2. Avoid any contact with the two cutting surfaces (C); 3. A vacuum pen is recommended on the top and bottom surfaces (B). Manual soldering recommendations LDEandLDBserieshavebeendesignedforSurfaceMountTechnology,pick&placemachinesandreflowsolderingsystems.Usinga manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350°C. Therefore please pay careful attention: • Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the tin wire edge (see Fig. 2); • If the soldering iron is equipped with a temperature controller device: Set the temperature to 250 ± 3°C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 seconds); • If the soldering iron is NOT equipped with a temperature controller device: This is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is extremely important: 1. Proceed as per Fig. 2; 2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible; 3. Wait a few seconds and check that the soldering joint has been properly created; • Ifthesolderingironisequippedwithahotairflowdevice: Set the hot air temperature to 250 ± 3°C and do not send the hot air directly onto the capacitor plastic body. In this situation, the operator’s experience is very important; • In any case, avoid mass-mounting SMD Film Capacitors manually. |
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