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F3082_LDB • 5/20/2015

7

Surface Mount Metallized PPS Film Capacitors

LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC

Soldering Process

Reflow Recommendations

Preheating

Maximum Preheating Time

180 seconds

Minimum Temperature

150°C

Maximum Temperature

200°C

Maximum Time within T

T

30 seconds (T

10 seconds (250 °C < T

Maximum Time Over 217°C

(∆T

150 seconds

Maximum Temperature Ramp Rate

3°C/seconds (heating)

6°C/seconds (cooling)

Secondreflow

Iftworeflowprocessesareneeded,besurethatbeforethesecondreflow,

the temperature on the capacitor’s surface is lower than 50°C.

* For LDB series this value is 260 °C.

Maximum Temperature on Component Body (T

Capacitor

H

< 350

350 – 2,000

> 2,000

< 1.6

255°C *

255°C *

255°C *

1.6 – 2.5

255°C *

250°C

245°C

> 2.5

250°C

245°C

245°C

*In line with JEDEC STD 020D ed. June 2007 with some limitations.

* For LDB series this value is 260 °C.

Flux/Cleaning/Storage and Moisture

Flux suggestions

Wesuggesttouseano-cleanfluxwithahalogencontentlowerthan0.1%.

Cleaning suggestions

To clean the PCB assembly we suggest to use a suitable solvent like Isopropyl Alcohol, deionized water or neutral pH detergents.

Solvents like Toluene, Xylene and Trichloroethylene should not be used.