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LDBCB2150JC5N0 Datasheet(PDF) 9 Page - Kemet Corporation |
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LDBCB2150JC5N0 Datasheet(HTML) 9 Page - Kemet Corporation |
9 / 12 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 5/20/2015 9 Surface Mount Metallized PPS Film Capacitors LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC Packaging Quantities Chip Size (EIA) Height (mm) Reel 1206 1.1 3000 1206 1.2 3000 1206 1.3 3000 1210 1.4 2250 1210 1.5 2250 1210 1.7 2250 1210 1.9 2250 1210 2.0 2250 1210 2.3 2250 1812 1.7 4000 1812 2.0 3000 Landing Size Dimensions in mm A B C D 1206 1.5 1.1 2.3 4.5 1210 2.3 1.1 2.3 4.5 1812 3 1.7 3.1 6.5 These landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design. We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 – 0.15 mm). If a NOT Lead Free solder paste is used, a minimum peak temperature of 210°C on the component’s body is suggested. |
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