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MMBT4403 Datasheet(PDF) 1 Page - Diotec Semiconductor

Part # MMBT4403
Description  Surface Mount General Purpose Si-Epi-Planar Transistors
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Manufacturer  DIOTEC [Diotec Semiconductor]
Direct Link  http://www.diotec.com
Logo DIOTEC - Diotec Semiconductor

MMBT4403 Datasheet(HTML) 1 Page - Diotec Semiconductor

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MMBT4403
MMBT4403
PNP
Surface Mount General Purpose Si-Epi-Planar Transistors
Si-Epi-Planar Universaltransistoren für die Oberflächenmontage
PNP
Version 2015-05-12
Dimensions - Maße [mm]
1 = B
2 = E
3 = C
Power dissipation – Verlustleistung
250 mW
Plastic case
Kunststoffgehäuse
SOT-23
(TO-236)
Weight approx. – Gewicht ca.
0.01 g
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Maximum ratings (TA = 25°C)
Grenzwerte (TA = 25°C)
MMBT4403
Collector-Emitter-volt. – Kollektor-Emitter-Spannung
B open
- VCEO
40 V
Collector-Base-voltage – Kollektor-Basis-Spannung
E open
- VCBO
40 V
Emitter-Base-voltage – Emitter-Basis-Spannung
C open
- VEB0
5 V
Power dissipation – Verlustleistung
Ptot
250 mW 1)
Collector current – Kollektorstrom (dc)
- IC
600 mA
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
Tj
TS
-55...+150°C
-55…+150°C
Characteristics (Tj = 25°C)
Kennwerte (Tj = 25°C)
Min.
Typ.
Max.
DC current gain – Kollektor-Basis-Stromverhältnis 2)
- IC = 0.1 mA, - VCE = 1 V
- IC = 1 mA,
- VCE = 1 V
- IC = 10 mA, - VCE = 1 V
- IC = 150 mA, - VCE = 2 V
- IC = 500 mA, - VCE = 2 V
hFE
hFE
hFE
hFE
hFE
30
60
100
100
20
300
h-Parameters at/bei - VCE = 10 V, - IC = 1 mA, f = 1 kHz
Small signal current gain – Kleinsignal-Stromverstärkung
hfe
60
500
Input impedance – Eingangs-Impedanz
hie
1.5 kΩ
15 kΩ
Output admittance – Ausgangs-Leitwert
hoe
1 µS
30 µS
Reverse voltage transfer ratio – Spannungsrückwirkung
hre
0.1*10-4
8*10-4
Collector-Emitter saturation voltage – Kollektor-Emitter-Sättigungsspg. 2)
- IC = 150 mA, - IB = 15 mA
- IC = 500 mA, - IB = 50 mA
- VCEsat
- VCEsat
0.40 V
0.75 V
1
Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss
2
Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%
© Diotec Semiconductor AG
http://www.diotec.com/
1
1.1
+0.1
0.4+0.1
2.9 ±0.1
1
2
3
Type
Code
1.9±0.1
-0.05
-0.2


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