Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

Product Dimensions

CG0402

CG0603

Dimension

Series

Series

L

1.00 ± 0.15

1.60 ± 0.20

(0.04 ± 0.006)

(0.064 ± 0.008)

W

0.50 ± 0.10

0.80 ± 0.20

(0.02 ± 0.004)

(0.032 ± 0.008)

A

0.36 ± 0.05

0.45 ± 0.10

(0.014 ± 0.002)

(0.018 ± 0.004)

B

0.25 ± 0.15

0.30 ± 0.20

(0.10 ± 0.006)

(0.012 ± 0.008)

DIMENSIONS:

MM

(INCHES)

Recommended Pad Layout

L

W

B

A

A

C

B

D

CG0402

CG0603

Dim.

Series

Series

A

0.51

0.76

(0.020)

(0.030)

B

0.61

1.02

(0.024)

(0.040)

C

0.51

0.50

(0.020)

(0.020)

D

1.70

2.54

(0.067)

(0.100)

Solder Reflow Recommendations

110 sec. (min.)

300

250

200

150

100

50

0

30-70

sec.

120 sec. (min.)

Preheat Stages 1-3

Soldering

Cooling

Time (seconds)

•

This product can be damaged by rapid heating, cooling or localized heating.

•

Heat shocks should be avoided. Preheating and gradual cooling recommended.

•

Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.

•

Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.

A solder gun under 30 watts is recommended.

A

Stage 1 Preheat

Ambient to Preheating

30 s to 60 s

Temperature

B

Stage 2 Preheat

140 °C to 160 °C

60 s to 120 s

C

Stage 3 Preheat

Preheat to 200 °C

20 s to 40 s

D

Main Heating

200 °C

60 s to 70 s

210 °C

55 s to 65 s

220 °C

50 s to 60 s

230 °C

40 s to 50 s

240 °C

30 s to 40 s

E

Cooling

200 °C to 100 °C

1 °C/s to 4 °C/s