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DMP32D5LFA-7B Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMP32D5LFA-7B Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 6 page DMP32D5LFA Document Number: DS37119 Rev. 3 - 2 2 of 6 www.diodes.com October 2014 © Diodes Incorporated DMP32D5LFA Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 30 V Gate-Source Voltage VGSS ±8 V Continuous Drain Current (Note 5) VGS = 4.5V Steady State TA = +25°C TA = +70°C ID -0.3 -0.2 A Pulsed Drain Current (Note 6) IDM -1.5 A Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Total Power Dissipation (Note 5) Steady State PD 360 mW Thermal Resistance, Junction to Ambient (Note 5) Steady State RJA 353 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS -30 — — V VGS = 0V, ID = -250μA Zero Gate Voltage Drain Current IDSS — — -100 nA VDS = -24V, VGS = 0V Gate-Source Leakage IGSS — — ±10 µA VGS = ±8V, VDS = 0V ON CHARACTERISTICS Gate Threshold Voltage VGS(th) -0.4 — -1.2 V VDS = VGS, ID = -250μA Static Drain-Source On-Resistance (Note 7) RDS(on) — 0.9 1.5 Ω VGS = -4.5V, ID = -200mA 1.2 2.5 VGS = -2.5V, ID = -100mA 2.5 7.5 VGS = -1.8V, ID = -50mA Diode Forward Voltage (Note 8) VSD — — -1.0 V VGS = 0V, IS = -10mA DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 40.9 — pF VDS = -15V, VGS = 0V, f = 1.0MHz Output Capacitance Coss — 4.7 — pF Reverse Transfer Capacitance Crss — 3.6 — pF Total Gate Charge Qg — 0.7 — nC VGS = -4.5V, VDS = -15V, ID = -200mA Gate-Source Charge Qgs — 0.1 — nC Gate-Drain Charge Qgd — 0.2 — nC Turn-On Delay Time tD(on) — 20 — ns VDS = -15V, ID = -200mA VGS = -4.5V, RG = 6Ω Turn-On Rise Time tr — 40 — ns Turn-Off Delay Time tD(off) — 144 — ns Turn-Off Fall Time tf — 58 — ns Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout. 6. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. |
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