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ADC14L040 Datasheet(PDF) 8 Page - Texas Instruments

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Part # ADC14L040
Description  235 mW A/D Converter
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ADC14L040 Datasheet(HTML) 8 Page - Texas Instruments

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VA
AGND
To Internal Circuitry
I/O
ADC14L040
SNAS311B – JUNE 2005 – REVISED APRIL 2013
www.ti.com
DC and Logic Electrical Characteristics
(1)(2)(3) (continued)
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR =
+2.5V, PD = 0V, External VREF = +1.0V, fCLK = 40 MHz, fIN = 20 MHz, tr = tf = 2 ns, CL = 15 pF/pin, Duty Cycle Stabilizer On.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C
Units
Symbol
Parameter
Conditions
Typical (4)
Limits (4)
(Limits)
PD Pin = DGND
8
12
mA (max)
ID
Digital Supply Current
PD Pin = VD , fCLK = 0
0
mA
PD Pin = DGND, CL = 5 pF
(5)
4
mA
IDR
Digital Output Supply Current
PD Pin = VD, fCLK = 0
0
mA
Total Power Consumption
PD Pin = DGND, CL = 5 pF
(6)
235
323
mW (max)
Power Down Power Consumption
PD Pin = VD, clock on
15
mW
Rejection of Full-Scale Error with
PSRR
Power Supply Rejection Ratio
72
dB
VA =3.0V vs. 3.6V
(5)
IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins,
the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x
f11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at
which that pin is toggling.
(6)
Excludes IDR. See Note 5.
AC Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR =
+2.5V, PD = 0V, External VREF = +1.0V, fCLK = 40 MHz, fIN = 10 MHz, tr = tf = 2 ns, CL = 15 pF/pin, Duty Cycle Stabilizer On.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C
(1) (2) (3) (4)
Units
Symbol
Parameter
Conditions
Typical(5)
Limits(5)
(Limits)
fCLK1
Maximum Clock Frequency
40
MHz (min)
fCLK2
Minimum Clock Frequency
5
MHz
tCH
Clock High Time
Duty Cycle Stabilizer On
12.5
5
ns (min)
tCL
Clock Low Time
Duty Cycle Stabilizer On
12.5
5
ns (min)
tCH
Clock High Time
Duty Cycle Stabilizer Off
12.5
10
ns (min)
tCL
Clock Low Time
Duty Cycle Stabilizer Off
12.5
10
ns (min)
tCONV
Conversion Latency
7
Clock Cycles
Data Output Delay after Rising Clock
tOD
6
9.6
ns (max)
Edge
tAD
Aperture Delay
2
ns
tAJ
Aperture Jitter
0.7
ps rms
0.1 µF on pins 30, 31, 32; 10 µF between
tPD
Power Down Mode Exit Cycle
280
µs
pins 30, 31
(1)
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per Note 4 under Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above
VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure accurate
conversions.
(2)
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
(3)
With the test condition for VREF = +1.0V (2VP-P differential input), the 14-bit LSB is 122.1 µV.
(4)
Timing specifications are tested at TTL logic levels, VIL = 0.4V for a falling edge and VIH = 2.4V for a rising edge.
(5)
Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing
Quality Level).
8
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