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5962-0720601VXC Datasheet(PDF) 10 Page - Texas Instruments |
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5962-0720601VXC Datasheet(HTML) 10 Page - Texas Instruments |
10 / 24 page 1.00 10.00 100.00 1000.00 80 90 100 110 120 130 140 150 160 170 180 Continuous Tj (°C) Electromigration Fail Mode 10 ADS5424-SP SLWS194D – MAY 2008 – REVISED SEPTEMBER 2013 www.ti.com Product Folder Links: ADS5424-SP Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated 5.1 THERMAL CHARACTERISTICS PARAMETER TEST CONDITIONS TYP UNIT RθJA Junction-to-free-air thermal resistance Board Mounted, Per JESD 51-5 methodology 21.81 °C/W RθJC Junction-to-case thermal resistance MIL-STD-883 Test Method 1012 0.849 °C/W 6 Thermal Notes This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI typically recommends a 16-mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad must be electrically at ground potential. Figure 2. ADS5424 Estimated Device Life at Elevated Temperatures Electromigration Fail Mode |
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