1.00

10.00

100.00

1000.00

80

90

100

110

120

130

140

150

160

170

180

Continuous Tj (°C)

Electromigration Fail Mode

10

ADS5424-SP

SLWS194D – MAY 2008 – REVISED SEPTEMBER 2013

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Copyright © 2008–2013, Texas Instruments Incorporated

5.1

THERMAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS

TYP

UNIT

Junction-to-free-air thermal resistance

Board Mounted, Per JESD 51-5 methodology

21.81

°C/W

Junction-to-case thermal resistance

MIL-STD-883 Test Method 1012

0.849

°C/W

6 Thermal Notes

This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the

bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is

required on the surface of the PCB directly underneath the body of the package. During normal surface mount

flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an

efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a

thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat

dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of

thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad

must be electrically at ground potential.

Figure 2. ADS5424 Estimated Device Life at Elevated Temperatures Electromigration Fail Mode