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ADS127L01IPBS Datasheet(PDF) 6 Page - Texas Instruments |
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ADS127L01IPBS Datasheet(HTML) 6 Page - Texas Instruments |
6 / 86 page 6 ADS127L01 SBAS607A – APRIL 2016 – REVISED MAY 2016 www.ti.com Product Folder Links: ADS127L01 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) To meet maximum speed conditions, fCLK duty cycle must be 49% < duty cycle < 51%. 6.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN NOM MAX UNIT POWER SUPPLY AVDD Analog power supply 2.7 3.0 3.6 V LVDD Low voltage analog supply INTLDO = 1 1.7 1.8 1.9 V DVDD Digital supply 1.7 1.8 3.6 V ANALOG INPUTS VIN Differential input voltage VIN = (VAINP – VAINN) –VREF VREF V VAINP, VAINN Absolute input voltage AINP or AINN to AGND AGND AVDD V VCM Common-mode input voltage VCM = (VAINP + VAINN) / 2 (AVDD + AGND) / 2 V VOLTAGE REFERENCE INPUTS VREFN Negative reference input AGND – 0.1 AGND AGND + 1.0 V VREFP Positive reference input VREFN + 0.5 2.5 AVDD V VREF Reference input voltage VREF = VREFP – VREFN 0.5 2.5 3.0 V EXTERNAL CLOCK SOURCE fCLK Master clock rate(1) HR mode 0.1 16.384 17.6 MHz LP mode 0.1 8.192 8.8 VLP mode 0.1 4.096 4.4 DIGITAL INPUTS Input voltage DGND DVDD V TEMPERATURE RANGE TA Operating ambient temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) ADS127L01 UNIT PBS (TQFP) 32 PINS RθJA Junction-to-ambient thermal resistance 73.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 15.9 °C/W RθJB Junction-to-board thermal resistance 26.7 °C/W ψJT Junction-to-top characterization parameter 0.4 °C/W ψJB Junction-to-board characterization parameter 26.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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