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BQ24070 Datasheet(PDF) 4 Page - Texas Instruments

Part # BQ24070
Description  System Power-Path Management IC
Download  33 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

BQ24070 Datasheet(HTML) 4 Page - Texas Instruments

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bq24070, bq24071
SLUS694G – MARCH 2006 – REVISED DECEMBER 2014
www.ti.com
Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
VREF
1
O
Internal reference signal
Ground input (the thermal pad on the underside of the package) There is an internal electrical connection
between the exposed thermal pad and VSS pin of the device. The exposed thermal pad must be
VSS
11
connected to the same potential as the VSS pin on the printed-circuit board. Do not use the thermal pad as
the primary ground input for the device. VSS pin must be connected to ground at all times.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Input voltage
IN (DC voltage with respect to VSS)
–0.3
18
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1, STAT2, TS, (all DC
–0.3
7
voltages with respect to VSS)
V
Input voltage
VO(OUT) +
VREF (DC voltage with respect to VSS)
–0.3
0.3
TMR
–0.3
VO + 0.3
Input current
3.5
OUT
4
A
Output current
BAT(2)
–4
3.5
Output source
current (in
VREF
30
mA
regulation at
3.3-V VREF)
Output sink
PG, STAT1, STAT2,
15
mA
current
Junction temperature, TJ
–40
150
Lead temperature (soldering, 10 s)
300
°C
Storage temperature, Tstg
–65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2)
Negative current is defined as current flowing into the BAT pin.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±250
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VCC
Supply voltage (VIN)
(1)
4.35
16
V
IIN
Input current
2
A
TJ
Operating junction temperature range
–40
125
°C
(1)
Verify that power dissipation and junction temperatures are within limits at maximum VCC .
4
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Copyright © 2006–2014, Texas Instruments Incorporated
Product Folder Links: bq24070 bq24071


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