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BQ24070 Datasheet(PDF) 4 Page - Texas Instruments |
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BQ24070 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page bq24070, bq24071 SLUS694G – MARCH 2006 – REVISED DECEMBER 2014 www.ti.com Pin Functions (continued) PIN I/O DESCRIPTION NAME NO. VREF 1 O Internal reference signal Ground input (the thermal pad on the underside of the package) There is an internal electrical connection between the exposed thermal pad and VSS pin of the device. The exposed thermal pad must be VSS 11 – connected to the same potential as the VSS pin on the printed-circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times. 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Input voltage IN (DC voltage with respect to VSS) –0.3 18 BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1, STAT2, TS, (all DC –0.3 7 voltages with respect to VSS) V Input voltage VO(OUT) + VREF (DC voltage with respect to VSS) –0.3 0.3 TMR –0.3 VO + 0.3 Input current 3.5 OUT 4 A Output current BAT(2) –4 3.5 Output source current (in VREF 30 mA regulation at 3.3-V VREF) Output sink PG, STAT1, STAT2, 15 mA current Junction temperature, TJ –40 150 Lead temperature (soldering, 10 s) 300 °C Storage temperature, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. (2) Negative current is defined as current flowing into the BAT pin. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±250 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance. 7.3 Recommended Operating Conditions MIN MAX UNIT VCC Supply voltage (VIN) (1) 4.35 16 V IIN Input current 2 A TJ Operating junction temperature range –40 125 °C (1) Verify that power dissipation and junction temperatures are within limits at maximum VCC . 4 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated Product Folder Links: bq24070 bq24071 |
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