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DAC8550IDGKRG4 Datasheet(PDF) 4 Page - Texas Instruments |
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DAC8550IDGKRG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page 4 DAC8550 SLAS476F – MARCH 2006 – REVISED MARCH 2016 www.ti.com Product Folder Links: DAC8550 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage GND –0.3 6 V Digital input voltage range GND –0.3 VDD + 0.3 V Output voltage GND –0.3 VDD + 0.3 V Junction temperature, TJ(max) 150 °C Operating temperature, TA –40 105 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 6.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN NOM MAX UNIT POWER SUPPLY VDD Supply voltage 2.7 5.5 V DIGITAL INPUTS DIN Digital input voltage SCLK and SYNC 0 VDD V REFERENCE INPUT VREF Reference input voltage 0 VDD V AMPLIFIER FEEDBACK INPUT VFB Output amplifier feedback input VO V TEMPERATURE RANGE TA Operating ambient temperature –40 105 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) DAC8550 UNIT DGK (VSSOP) 8 PINS RθJA Junction-to-ambient thermal resistance 206 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44 °C/W RθJB Junction-to-board thermal resistance 94.2 °C/W ψJT Junction-to-top characterization parameter 10.2 °C/W ψJB Junction-to-board characterization parameter 92.7 °C/W |
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