4

DAC8550

SLAS476F – MARCH 2006 – REVISED MARCH 2016

www.ti.com

Product Folder Links: DAC8550

Submit Documentation Feedback

Copyright © 2006–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

GND

–0.3

6

V

Digital input voltage range

GND

V

Output voltage

GND

V

150

°C

–40

105

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

POWER SUPPLY

Supply voltage

2.7

5.5

V

DIGITAL INPUTS

Digital input voltage

SCLK and SYNC

0

V

REFERENCE INPUT

Reference input voltage

0

V

AMPLIFIER FEEDBACK INPUT

Output amplifier feedback input

V

TEMPERATURE RANGE

Operating ambient temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

DAC8550

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

206

°C/W

Junction-to-case (top) thermal resistance

44

°C/W

Junction-to-board thermal resistance

94.2

°C/W

Junction-to-top characterization parameter

10.2

°C/W

Junction-to-board characterization parameter

92.7

°C/W