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DCP020505 Datasheet(PDF) 5 Page - Texas Instruments |
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DCP020505 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 28 page DCP020503, DCP020505, DCP020507, DCP020509, DCP020515D, DCP021205 DCP021212, DCP021212D, DCP021515, DCP022405, DCP022405D, DCP022415D www.ti.com SBVS011L – MARCH 2000 – REVISED MAY 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 5-V input devices 7 12-V input devices 15 Input voltage V 15-V input devices 18 24-V input devices 29 Storage temperature, Tstg –60 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±250 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT 5-V input devices 4.5 5 5.5 12-V input devices 10.8 12 13.2 Input Voltage V 15-V input devices 13.5 15 16.5 24-V input devices 21.6 24 26.4 Operating temperature –40 85 °C 7.4 Thermal Information DCP020x DCP020x THERMAL METRIC(1) NVA (PDIP) DVB (SOP) UNIT 7 PINS 12 PINS RθJA Junction-to-ambient thermal resistance 61 61 RθJC(top) Junction-to-case (top) thermal resistance 19 19 RθJB Junction-to-board thermal resistance 24 24 °C/W ψJT Junction-to-top characterization parameter 7 7 ψJB Junction-to-board characterization parameter 24 24 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: DCP020503 DCP020505 DCP020507 DCP020509 DCP020515D DCP021205 DCP021212 DCP021212D DCP021515 DCP022405 DCP022405D DCP022415D |
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