DAC7654

SBAS263A − NOVEMBER 2003 − REVISED DECEMBER 2005

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2

PRODUCT

PACKAGE−LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT

MEDIA, QUANTITY

DAC7654Y

LQFP−64

PM

−40

°C to +85°C

DAC7654Y

DAC7654YT

Tape and Reel, 250

DAC7654Y

LQFP−64

PM

−40

°C to +85°C

DAC7654Y

DAC7654YR

Tape and Reel, 1500

DAC7654YB

LQFP−64

PM

−40

°C to +85°C

DAC7654YB

DAC7654YBT

Tape and Reel, 250

DAC7654YB

LQFP−64

PM

−40

°C to +85°C

DAC7654YB

DAC7654YBR

Tape and Reel, 1500

DAC7654YC

LQFP−64

PM

−40

°C to +85°C

DAC7654YC

DAC7654YCT

Tape and Reel, 250

DAC7654YC

LQFP−64

PM

−40

°C to +85°C

DAC7654YC

DAC7654YCR

Tape and Reel, 1500

(1) For the most current specification and package information, see the Package Ordering Addendum at the end of this data sheet.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

DAC7654

UNIT

IOVDD, VCC and VDD to VSS

−0.3 to 11

V

IOVDD, VCC and VDD to GND

−0.3 to 5.5

V

Digital Input Voltage to GND

−0.3 to VDD + 0.3

V

Digital Output Voltage to GND

−0.3 to VDD + 0.3

V

ESD-CDM

200

V

Maximum Junction Temperature

+150

°C

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +125

°C

Lead Temperature (soldering, 10s)

+300

°C

(1) Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to

absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond

those specified is not implied.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.