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CD74FCT821AM Datasheet(PDF) 2 Page - Texas Instruments |
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CD74FCT821AM Datasheet(HTML) 2 Page - Texas Instruments |
2 / 9 page CD74FCT821A BiCMOS 10-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS SCBS731 − JULY 2000 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic symbol† 6Q 18 7Q 17 8Q 16 9Q 15 10Q 14 7 6D 8 7D 9 8D 10 9D EN 1 1Q 23 3 2D 4 3D 5 4D 6 5D 2Q 22 3Q 21 4Q 20 5Q 19 13 CLK OE 11 10D C1 1D 2 1D † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1D OE 2 1 13 1Q 23 CLK 1D To Nine Other Channels C1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ DC supply voltage range, VCC −0.5 V to 6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC input clamp current, IIK (VI < −0.5 V) −20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC output clamp current, IOK (VO < −0.5 V) −50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC output sink current per output pin, IOL 70 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC output source current per output pin, IOH −30 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous current through VCC, (ICC) 260 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous current through GND 500 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 1): EN package 67 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M package 46 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51. |
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