CDCM1802_15 datasheet(4/30 Pages) TI1

Part #	CDCM1802

Description	CDCM1802 Clock Buffer With Programmable Divider, LVPECL I/O Additional LVCMOS Output

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Manufacturer	TI1 [Texas Instruments]

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CDCM1802

SCAS759B – APRIL 2004 – REVISED NOVEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

Supply voltage

−0.3

3.8

V

VI

Input voltage

−0.2

(VDD + 0.2)

V

VO

Output voltage

−0.2

(VDD + 0.2)

V

Yn, Yn, IOSD

Differential short circuit current

Continuous

TJ

Maximum junction temperature

125

°C

Tstg

Storage temperature

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Supply voltage

3

3.3

3.6

V

VDD

Supply voltage (only functionality)

2.375

3.6

V

TA

Operating free-air temperature

–40

85

°C

6.4 Thermal Information

CDCM1802

THERMAL METRIC(1)

RGT (VQFN)

UNIT

16 PINS

RθJA

Junction-to-ambient thermal resistance

48.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

66.9

°C/W

RθJB

Junction-to-board thermal resistance

22.5

°C/W

ψJT

Junction-to-top characterization parameter

1.7

°C/W

ψJB

Junction-to-board characterization parameter

22.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

5.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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