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DRV5053VAQLPGM Datasheet(PDF) 4 Page - Texas Instruments |
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DRV5053VAQLPGM Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page DRV5053 SLIS153C – MAY 2014 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC –22(2) 40 V Power supply voltage Voltage ramp rate (VCC), VCC < 5 V Unlimited V/µs Voltage ramp rate (VCC), VCC > 5 V 0 2 Output pin voltage –0.5 2.5 V Output pin reverse current during reverse supply condition 0 –20 mA Magnetic flux density, BMAX Unlimited Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Ensured by design. Only tested to –20 V. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2500 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Power supply voltage 2.5 38 V VOUT Output pin voltage (OUT) 0 2 V ISOURCE Output pin current source (OUT) 0 300 µA ISINK Output pin current sink (OUT) 0 2.3 mA TA Operating ambient temperature –40 125 °C 6.4 Thermal Information DRV5053 THERMAL METRIC(1) DBZ (SOT-23) LPG (TO-92) UNIT 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 333.2 180 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.9 98.6 °C/W RθJB Junction-to-board thermal resistance 66.9 154.9 °C/W ψJT Junction-to-top characterization parameter 4.9 40 °C/W ψJB Junction-to-board characterization parameter 65.2 154.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: DRV5053 |
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