DP83867IRPAPT datasheet(2/132 Pages) TI1

Part #	DP83867IRPAPT

Description	DP83867IR/CR Robust, High Immunity 10/100/1000 Ethernet Physical Layer Transceiver

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Manufacturer	TI1 [Texas Instruments]

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DP83867IR, DP83867CR

SNLS484D – FEBRUARY 2015 – REVISED JULY 2016

www.ti.com

Product Folder Links: DP83867IR DP83867CR

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 3

5

Device Comparison ............................................... 7

6

Pin Configuration and Functions ......................... 7

6.1

Unused Pins........................................................... 12

7

Specifications....................................................... 13

7.1

Absolute Maximum Ratings .................................... 13

7.2

ESD Ratings............................................................ 13

7.3

Recommended Operating Conditions ..................... 14

7.4

Thermal Information ................................................ 14

7.5

Electrical Characteristics......................................... 14

7.6

Powerup Timing ..................................................... 16

7.7

Reset Timing ........................................................... 17

7.8

MII Serial Management Timing ............................... 18

7.9

RGMII Timing .......................................................... 19

7.10

GMII Transmit Timing ........................................... 21

7.11

GMII Receive Timing ............................................ 22

7.12

100Mbps MII Transmit Timing .............................. 23

7.13

100Mbps MII Receive Timing ............................... 23

7.14

10Mbps MII Transmit Timing ................................ 24

7.15

10Mbps MII Receive Timing ................................. 24

7.16

Typical Characteristics .......................................... 25

8

Detailed Description ............................................ 26

8.1

Overview ................................................................. 26

8.2

Functional Block Diagram ....................................... 27

8.3

Feature Description................................................. 29

8.4

Device Functional Modes........................................ 31

8.5

Programming .......................................................... 46

8.6

Register Maps ......................................................... 55

9

Application and Implementation ...................... 113

9.1

Application Information.......................................... 113

9.2

Typical Application ............................................... 113

10

Power Supply Recommendations ................... 117

11

Layout................................................................. 120

11.1

Signal Traces ...................................................... 120

11.2

Return path ......................................................... 120

11.3

Transformer Layout............................................. 121

11.4

Metal Pour........................................................... 121

11.5

PCB Layer Stacking ............................................ 121

11.6

Layout Example .................................................. 122

12

Device and Documentation Support ............... 123

12.1

Documentation Support ..................................... 123

12.2

Related Links ...................................................... 123

12.3

Receiving Notification of Documentation

Updates.................................................................. 123

12.4

Community Resources........................................ 123

12.5

Trademarks ......................................................... 123

12.6

Electrostatic Discharge Caution .......................... 123

12.7

Glossary .............................................................. 123

13

Mechanical, Packaging, and Orderable

Information ......................................................... 123

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