BUF08630

SBOS515A – OCTOBER 2010 – REVISED AUGUST 2012

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE

PACKAGE DESIGNATOR

PACKAGE MARKING

BUF08630

VQFN-20

RGW

BUF08630

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

BUF08630

UNIT

+22

V

Supply voltage

V

+6

V

Digital input pins, SCL, SDA, AO, BKSEL: voltage

–0.5 to +6

V

Digital input pins, SCL, SDA, AO, BKSEL: current

±10

mA

V

V

(2)

(V–) – 0.5 to (V+) + 0.5

V

Continuous

Ambient operating temperature

–40 to +95

°C

Ambient storage temperature

–65 to +150

°C

+125

°C

Human body model (HBM)

4

kV

ESD ratings

Charged device model (CDM)

1

kV

Machine model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

See the Output Protection section.

(3)

Short-circuit to ground, one amplifier per package. Exposed thermal die is soldered to the printed circuit board (PCB) using thermal vias.

Refer to Texas Instruments' application report SLAU271, QFN/SON PCB Attachment.

THERMAL INFORMATION

BUF08630

RGW

UNITS

20 PINS

Junction-to-ambient thermal resistance

42.4

Junction-to-case(top) thermal resistance

34.4

Junction-to-board thermal resistance

10.4

°C/W

Junction-to-top characterization parameter

8.2

Junction-to-board characterization parameter

42.4

Junction-to-case(bottom) thermal resistance

2.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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