Electronic Components Datasheet Search |
|
BUF08630RGWT Datasheet(PDF) 2 Page - Texas Instruments |
|
|
BUF08630RGWT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page BUF08630 SBOS515A – OCTOBER 2010 – REVISED AUGUST 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE PACKAGE DESIGNATOR PACKAGE MARKING BUF08630 VQFN-20 RGW BUF08630 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). BUF08630 UNIT VS +22 V Supply voltage VSH GND + 4.0 < VSH < VS – 4.0 V VSD +6 V Digital input pins, SCL, SDA, AO, BKSEL: voltage –0.5 to +6 V Digital input pins, SCL, SDA, AO, BKSEL: current ±10 mA Output pins, OUT1 through OUT4(2) (V–) – 0.5 to (VSH) + 0.5 V Output pins, OUT5 through OUT8(2) (VSH) – 0.5 to (V+) + 0.5 V VCOM (2) (V–) – 0.5 to (V+) + 0.5 V Output short-circuit(3) Continuous Ambient operating temperature –40 to +95 °C Ambient storage temperature –65 to +150 °C Junction temperature, TJ +125 °C Human body model (HBM) 4 kV ESD ratings Charged device model (CDM) 1 kV Machine model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) See the Output Protection section. (3) Short-circuit to ground, one amplifier per package. Exposed thermal die is soldered to the printed circuit board (PCB) using thermal vias. Refer to Texas Instruments' application report SLAU271, QFN/SON PCB Attachment. THERMAL INFORMATION BUF08630 THERMAL METRIC(1) RGW UNITS 20 PINS θJA Junction-to-ambient thermal resistance 42.4 θJC(top) Junction-to-case(top) thermal resistance 34.4 θJB Junction-to-board thermal resistance 10.4 °C/W ψJT Junction-to-top characterization parameter 8.2 ψJB Junction-to-board characterization parameter 42.4 θJC(bottom) Junction-to-case(bottom) thermal resistance 2.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Links: BUF08630 |
Similar Part No. - BUF08630RGWT |
|
Similar Description - BUF08630RGWT |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |