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HD3SS214IZQER Datasheet(PDF) 5 Page - Texas Instruments |
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HD3SS214IZQER Datasheet(HTML) 5 Page - Texas Instruments |
5 / 25 page 5 HD3SS214 www.ti.com SLAS907A – DECEMBER 2015 – REVISED JULY 2016 Product Folder Links: HD3SS214 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-B 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage range(3) VDD –0.5 4 V Voltage range Differential I/O –0.5 4 V Control pin –0.5 VDD + 0.5 Continuous power dissipation See Thermal Information (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 6.3 Recommended Operating Conditions Typical values for all parameters are at VCC = 3.3 V and TA = 25°C. All temperature limits are specified by design. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VDD Supply voltage 3 3.3 3.6 V VIH Input high voltage Control Pins, Signal Pins (Dx_SEL, AUX_SEL, MODE, OE) 2 VDD V VIM Input mid level voltage AUX_SEL Pin VDD/2 -300 mV VDD/2 VDD/2 -300 mV V VIL Input low voltage Control Pins, Signal Pins (Dx_SEL, AUX_SEL, MODE, OE) -0.1 0.8 V VI/O_Diff Differential voltage (Dx, AUXx) Switch I/O diff voltage 0 1.8 Vpp VI/O_CM Dx switching I/O Common mode voltage Switch I/O common mode voltage 0 2 V AUXx (1) switching I/O Common mode voltage 0 3.6 Operating free-air temperature HD3SS214 0 70 °C HD3SS214I –40 105 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) HD3SS214 UNIT ZQE (µBGA) 50 PINS RθJA Junction-to-ambient thermal resistance 90.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 41.9 °C/W RθJB Junction-to-board thermal resistance 53.9 °C/W ψJT Junction-to-top characterization parameter 1.8 °C/W ψJB Junction-to-board characterization parameter 53.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W |
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