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LDC1041 Datasheet(PDF) 5 Page - Texas Instruments

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Part # LDC1041
Description  8-bit Rp, 24-bit L Inductance-to-Digital Converter with SPI
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LDC1041 Datasheet(HTML) 5 Page - Texas Instruments

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LDC1041
www.ti.com
SNOSCY1 – MARCH 2014
6.5 Electrical Characteristics
(1)
Unless otherwise specified, all limits ensured for TA = TJ = 25°C, VDD = 5 V, VIO = 3.3 V
(2)
PARAMETER
TEST CONDITIONS
MIN(3)
TYP(4)
MAX(3)
UNIT
POWER
VDD
Analog supply voltage
4.75
5
5.25
V
VIO
IO supply voltage
VIO≤VDD
1.8
3.3
5.25
V
IDD
Supply current, VDD
Does not include sensor current.(5)
1.7
2.3
mA
IVIO
IO supply current
Static current
14
µA
IDD_LP
Stand-by mode supply
250
µA
current
tSTART
Start-Up Time
From POR to ready-to-convert.
2
ms
LDC
ƒsensor_MIN
Minimum sensor frequency
5
kHz
ƒsensor_MAX Maximum sensor frequency
5
MHz
Asensor_MIN Minimum sensor amplitude
1
VPP
Asensor_MAX Maximum sensor amplitude
4
VPP
tREC
Oscillation start-up time after Rp under-
Recovery time
10
1/fsensor
range condition
Rp Min
Minimum sensor Rp range
798
Rp Max
Maximum Sensor Rp range
3.93
M
Rp Res
Rp measurement resolution
8
Bits
L Res
Inductance measurement
24
Bits
resolution
tS_MIN
Minimum programmable settling time of
Minimum response time
192 × 1 / ƒsensor
s
digital filter
tS_MAX
Maximum programmable settling time
6144 × 1 /
Maximum response time
s
of digital filter
ƒsensor
EXTERNAL CLOCK
ƒ
External clock frequency
8
MHz
DIGITAL I/O CHARACTERISTICS
VIH
Logic 1 input voltage
0.8 × VIO
V
VIL
0.2 ×
Logic 0 input voltage
V
VIO
VOH
Logic 1 output voltage
ISOURCE = 400 µA
VIO – 0.3
V
VOL
Logic 0 output voltage
ISINK = 400 µA
0.3
V
IIOHL
Digital IO leakage current
–500
500
nA
(1)
Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2)
The maximum power dissipation is a function of TJ(MAX),
θJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/
θJA. All numbers apply for packages soldered directly onto a PC
board. The package thermal impedance is calculated in accordance with JESD 51-7.
(3)
Limits are specified by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are specified through
correlations using statistical quality control (SQC) method.
(4)
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(5)
LC tank current depends on the Q-factor of the tank, distance and material of the target.
Copyright © 2014, Texas Instruments Incorporated
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