LM25056A

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SNVS785A – JANUARY 2011 – REVISED APRIL 2013

PIN DESCRIPTIONS

Pin

Name

Description

Applications Information

No.

PAD

Exposed

Exposed pad of WQFN

No internal electrical connections. Solder to the ground plane to reduce thermal

Pad

package

resistance.

1

ADR2

SMBus address line 2

3 - state address line. Should be connected to GND, VDD, or left floating.

2

ADR1

SMBus address line 1

3 - state address line. Should be connected to GND, VDD, or left floating.

3

ADR0

SMBus address line 0

3 - state address line. Should be connected to GND, VDD, or left floating.

4

VDD

Internal sub-regulator

Internally sub-regulated 3.7V bias supply. Connect a 1 µF capacitor on this pin to ground

output

for bypassing. VDD can be driven from an external voltage for low voltage operation.

5

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

6

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

7

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

8

VS-

Current sense input (-)

measured from VS+ to this pin.

9

VS+

Current sense input (+)

measured from this pin to VS-.

10

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

11

VIN

Positive supply input

A small 0.1 µF ceramic bypass capacitor close to this pin is recommended. VIN is

measured from this pin.

12

ENABLE

Enable

Enable pin. This pin has a rising threshold of +1.2V to enable the LM25056A. Lowering

this pin below the 75mV hysteresis from the +1.2V threshold will put the part into power

down mode.

13

VAUX

Auxiliary voltage input

Auxiliary pin allows voltage telemetry from an external source. Full scale input of 1.2V

14

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

15

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

16

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

17

AGND

Analog ground

Connect analog ground to digital ground and then to a quiet system ground. Be sure to

avoid high current return ground lines.

18

NC

No Connect

Not bonded to die. Can be connected to the ground plane.

19

DGND

Digital ground

Connect analog ground to digital ground and then to a clean system ground. Be sure to

avoid high current return ground lines.

20

SDA

SMBus data pin

Data pin for SMBus.

21

SCL

SMBus clock

Clock pin for SMBus.

22

SMBA

SMBus alert line

Alert pin for SMBus. Active low.

23

VREF

Internal reference

Internally generated precision 2.82V reference used for analog to digital conversion.

Connect a 1 µF ceramic capacitor on this pin to ground for bypassing.

24

DIODE

External diode

Connect this to a diode-configured MMBT3904 NPN transistor for temperature monitoring.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

VIN, VS-, VS+ to AGND/DGND

-0.3V to 24V

SCL, SDA, SMBA, ADR0, ADR1, ADR2, VDD, VAUX, DIODE, ENABLE to AGND/DGND

-0.3V to 6V

VS+ to VS-

-0.3V to +0.3V

Human Body Model

2kV

Storage Temperature

-65°C to +150°C

Junction Temperature

+150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional. For specifications and conditions see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Office/Distributors for availability and specifications.

(3)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin.

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