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BCM4356XKUBGT Datasheet(PDF) 10 Page - Cypress Semiconductor |
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BCM4356XKUBGT Datasheet(HTML) 10 Page - Cypress Semiconductor |
10 / 195 page Table of Contents BCM4356 Advance Data Sheet Broadcom® May 8, 2015 • 4356-DS103-R Page 9 BROADCOM CONFIDENTIAL Section 18: Internal Regulator Electrical Specifications ............................................. 160 Core Buck Switching Regulator.............................................................................................................. 160 3.3V LDO (LDO3P3) .................................................................................................................................. 161 3.3V LDO (LDO3P3_B).............................................................................................................................. 162 2.5V LDO (BTLDO2P5) ............................................................................................................................. 163 CLDO ......................................................................................................................................................... 164 LNLDO ....................................................................................................................................................... 165 Section 19: System Power Consumption...................................................................... 166 WLAN Current Consumption................................................................................................................... 166 Bluetooth and FM Current Consumption ............................................................................................... 168 Section 20: Interface Timing and AC Characteristics .................................................. 169 SDIO Timing.............................................................................................................................................. 169 SDIO Default Mode Timing ................................................................................................................. 169 SDIO High-Speed Mode Timing.......................................................................................................... 171 SDIO Bus Timing Specifications in SDR Modes ................................................................................. 172 Clock Timing ................................................................................................................................ 172 Device Input Timing ..................................................................................................................... 173 Device Output Timing................................................................................................................... 174 SDIO Bus Timing Specifications in DDR50 Mode............................................................................... 177 Data Timing, DDR50 Mode .......................................................................................................... 178 PCI Express Interface Parameters .......................................................................................................... 179 JTAG Timing ............................................................................................................................................. 181 Section 21: Power-Up Sequence and Timing ............................................................... 182 Sequencing of Reset and Regulator Control Signals ........................................................................... 182 Description of Control Signals ............................................................................................................. 182 Control Signal Timing Diagrams.......................................................................................................... 183 Power-up Sequences .......................................................................................................................... 185 Section 22: Package Information ................................................................................... 187 Package Thermal Characteristics ........................................................................................................... 187 Junction Temperature Estimation and PSIJT Versus ThetaJC.............................................................. 188 Environmental Characteristics................................................................................................................ 188 Section 23: Mechanical Information .............................................................................. 189 Section 24: Ordering Information .................................................................................. 193 |
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