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LM2750 Datasheet(PDF) 3 Page - Texas Instruments

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Part # LM2750
Description  LM2750 Low-Noise Switched-Capacitor Boost Regulator
Download  29 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM2750 Datasheet(HTML) 3 Page - Texas Instruments

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Top View
1
2
3
4
5
10
9
8
7
6
VOUT
VOUT
GND/FB*
SD
GND
C+
VIN
VIN
C-
GND
Bottom View
10
9
8
7
6
1
2
3
4
5
Die-Attach
Pad (DAP)
GND
Die-Attach
Pad (DAP)
GND
VOUT
VOUT
GND/FB*
SD
GND
C+
VIN
VIN
C-
GND
* LM2750-5.0: Pin 3 = GND; LM2750-ADJ: Pin 3 = FB
3
LM2750, LM2750-ADJ
www.ti.com
SNVS180N – APRIL 2002 – REVISED APRIL 2016
Product Folder Links: LM2750 LM2750-ADJ
Submit Documentation Feedback
Copyright © 2002–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
NGY or DSC Package
10-Pin WSON
Pin Names and Numbers apply to both NGY0010A and DSC0010A packages.
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
LM2750-5.0
LM2750-ADJ
CAP+
10
10
P
Flying capacitor positive terminal
CAP–
7
7
P
Flying capacitor negative terminal
FB
—
3
P
Feedback pin
GND
3
—
G
This pin must be connected externally to the ground pins (pins 5, 6, and the
DAP).
GND
5, 6
5, 6
G
Ground - These pins must be connected externally.
SD
4
4
I/O
Active-low shutdown input. A 200-k
Ω resistor is connected internally between this
pin and GND to pull the voltage on this pin to 0 V, and shut the part down, when
the pin is left floating.
VIN
8, 9
8, 9
P
Input voltage - The pins must be connected externally.
VOUT
1, 2
1, 2
P
Output voltage - These pins must be connected externally.
DAP
√
√
GND
The DAP (Exposed Pad) functions as a thermal connection when soldered to a
copper plane.


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