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LM2755 Datasheet(PDF) 3 Page - Texas Instruments |
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LM2755 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 21 page LM2755 www.ti.com SNVS433D – OCTOBER 2007 – REVISED APRIL 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) (3) VIN pin voltage −0.3V to 6.0V SCL, SDIO, VIO, −0.3V to (VIN+0.3V) ADDR, SYNC pin voltages w/ 6.0V max IDx Pin Voltages −0.3V to (VPOUT+0.3V) w/ 6.0V max Continuous Power Dissipation Internally Limited (4) Junction Temperature (TJ-MAX) 150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering) (5) ESD Rating(6) Human Body Model 2.5kV (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply verified performance limits. For verified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and disengages at TJ = 155°C (typ.). (5) For detailed soldering specifications and information, please refer to STET Application Note 1112: DSBGA Wafer Level Chip Scale Package (AN-1112 SNVA009). (6) The human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. (MIL-STD-883 3015.7) OPERATING RATINGS (1) (2) Input Voltage Range 2.7V to 5.5V Junction Temperature (TJ) Range −30°C to 105°C Ambient Temperature (TA) Range (3) −30°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply verified performance limits. For verified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 105°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES Junction-to-Ambient Thermal 56°C/W Resistance ( θJA), YFQ0018 Package (1) (1) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to Texas Instruments STET Application Note 1112: DSBGA Wafer Level Chip Scale Package (AN-1112 SNVA009). Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2755 |
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